| 摘要 |
<p>A resin-encapsulated semiconductor device (10) comprises a semiconductor chip (11); a thin radiation shield (14) disposed in close contact with a circuit element-formed surface of the chip; internal leads (15) bonded to the electrodes on the chip; external leads (17) bonded to the internal leads; and a sealing resin (19) molded around the chip, the radiation shield, and the internal leads. Such a construction can provide the chip with practical protection from radiation. In manufacturing the devices, the radiation shield is advantageously used to support the internal leads before they are bonded to the electrodes.</p> |
