| 摘要 |
PURPOSE:To improve the characteristic of moisture resistance by a method wherein a sealing is performed with resin or ceramic after coating a baking film of metallic alcoxide on a semiconductor element and baking it. CONSTITUTION:Sealing is performed with resin or ceramic sealing resin 3, after the baking film 5 of metallic alcoxide is baked to the semiconductor element 1 and lead wires 2. For the metallic alcoxide, aluminum methoxide, aluminum ethoxide, etc. is used; at the time of baking, the solution of the metallic alcoxide is coated and thereafter pre-dried by air drying, and next baking is performed at 100 deg.C or more. In this manner, the adhesion property between the semiconductor element 1 and the sealing resin 3 is enhanced, and therefore the moisture resistance is improved. |
