| 摘要 |
PURPOSE:To prevent adhesion of dust to a transport surface in an air conveyer for transporting wafer in the manufacturing process of a semiconductor device by forming dust conducting holes along both ends of the transport path surface. CONSTITUTION:A lot of elongated holes 8 for conducting dust are aligned in a row on a path surface of an air conveyer 1 along guides 3, 3 disposed on both side ends thereof. The elongated hole 8 is pierced through from the upper surface to the lower surface. In this arrangement, dust 10 generated by chipping of a wafer 7 and a guide 3 during transportation is put forth through the elongated holes 8 to the lower surface by air jetted from an air jet 6. Accordingly, the adhesion of rubber to the transport path surface can be prevented. |
