| 摘要 |
<p>PURPOSE:To obtain a filler which is well refined as a sealing agent of semiconductor element and is favorable in cost by using a surface-oxidized silicon powder of semiconductor class having volume resistivity of green compact of a value higher than the particular value as a filler. CONSTITUTION:A volume resistivity of green compact under a pressure of 20kg/ cm<2> is 10<7>OMEGA-cm<2> or more. Powder of silicon of semiconductor class of which surface is oxidized is used as a filler for semiconductor sealing agent. In this case, a silicon of semiconductor class to be used means a silicon containing uranium under 1ppb. Thereby, it can be prevented that the alpha ray of charged particles derived from a little amount of uranium contained in an ordinary filler material gives erroneous operation to a large scale integrated circuit. Moreover, this silicon has a high thermal conductivity and therefore thermal deterioration of element due to increased Joule's heat can be prevented. In addition, it can meet a cubic material resistivity as a sealing agent for integrated circuit by specifying an electrical resistivity under the loaded pressure.</p> |
