| 摘要 |
PURPOSE:To effectively cool an IC and realize aging test with a high productivity by loading a tape carrier type IC and providing a ventirating mechanism, which is required for cooling semiconductor element during aging test to be conducted while IC is held by the clamping substrate, to said clamping substrate. CONSTITUTION:A tape carrier 5 carrying many semiconductor elements 10 having a metal lead 11 is put on a substrate 2 and the aging test is carried out for groups of element 10 by clamping them with a clamping plate 6. In such a structure, a ventirating tube 7 having a plurality of blowing ports 8 in the longitudinal direction at the center is provided through the clamping plate 6 and the wind sent from the aging tank is supplied to the one connecting port 9. Thereby, the heat generated on the element 10 and metal lead 11 is effectively absorbed. |
