| 摘要 |
PURPOSE:To prevent deterioration of bonding strength between wire and bonding pad by forming a bonding pad on a thick film to which a wire is connected on the through hole. CONSTITUTION:A wiring layer 2 of lower layer is formed on a ceramic substrate 1. Then, a through hole 4 is formed by an insulating layer 3 at the position where a bonding pad 5 is formed. Thereafter, a bonding pad 5 is formed on the through hole 4. Thereby, a bonding pad 5 is formed as a recess. A thick film integrated circuit thus produced is capable of preventing deterioration of bonding strength of wire because a sufficient pressure is applied to the wire at the time of wire bonding. |
