发明名称 SEMICONDUCTOR DEVICE WITH SIGNAL EXCHANGING MEANS
摘要 PROBLEM TO BE SOLVED: To exchange signals without having a galvanic link, by integrating one of two parts of a signal exchanging means which are opposed to each other with a gap into a chip to constitute one constituent element of an integrated circuit, and by forming the other on a substrate and connecting it to a connection means. SOLUTION: No ball exists in regions 14, 15 lying on the sides of the wall 6 of a package 3 and a semiconductor device 1 has a signal exchanging means constituted by two parts in the region where the ball does not exist. One of the parts comprises an inductor 15 having coplanar winding and is integrated into a chip 2 to constitute one constituent element of the integrated circut of the chip 2. The other of the parts comprises an inductor 16 having the coplanar winding, is formed on the inside 11 of the wall 6 of the package 3 by a screen printing, and has end terminals connected to balls 8a, 8b of the external matrix of a ball 8 via connections 7a, 7b.
申请公布号 JPH11154726(A) 申请公布日期 1999.06.08
申请号 JP19980180360 申请日期 1998.06.26
申请人 ST MICROELECTRON SA 发明人 JAOUEN HERVE;MARTY MICHEL
分类号 H01L23/12;H01F17/00;H01L23/64;H01L25/00;(IPC1-7):H01L25/00 主分类号 H01L23/12
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