发明名称 ADHESIVES AND SEALANTS CONTAINING ADHESION PROMOTER COMPRISING WASTE POWDER PRIME
摘要 <p>Waste powder prime comprising from about 30 to about 70 weight percent epoxy resin, the balance of the waste powder prime comprising filler, pigment and/or curing agent, is advantageously employed as a replacement for epoxy resins in conventional adhesion promoter systems for polymeric plastisols. The resulting compositions are useful as adhesives and sealants in industrial manufacturing processes such as in the manufacture of automobiles.</p>
申请公布号 WO1999028378(A1) 申请公布日期 1999.06.10
申请号 US1998025197 申请日期 1998.12.02
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