| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device whereby the manufacturing and assembling are easy. SOLUTION: A semiconductor substrate is adhered to a support plate, an anode layer 1 is exposed, a mask film is formed on the anode layer 1, other part than a semiconductor device-forming region is etched to form a recess, the mask film is removed, a low-m.p. glass is filled in the recess so as to surround the semiconductor device-forming region, an anode electrode 10 and cathode electrode 12 connected to the anode layer 1 and cathode layer 3 at the semiconductor device-forming region are formed and low-m. p. parts between the semiconductor devices are cut off to complete the semiconductor devices.</p> |
