发明名称 ASSEMBLING DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To assemble bases of various size while a feed-pitch mechanism on the assembling device side is left as it is by constituting a base-feed jig at the same pitch regardless of base size and forming an empty-feed movement display section at a pitch-position where the jig cannot be disposed. CONSTITUTION:When the feed jig 11 on which the bases 22 are loaded is moved intermittently and a through-hole 21 is moved to a base detecting section 15, beams from a light-emitting source 16 reaches a photodetector 17, the absence of the base is detected by the photodetector 17 and a circuit connected to the detector 17, and a rotating column 14 and a wire bonder are not operated even when the next pitch-feed operation is executed and the through-hole 21 is moved to the position of the rotating column. When a hole 20 for mounting is moved to the base detecting section 15, an operating signal is outputted in a circuit section, and the rotating column 14 and the wire bonder 18 are operated at a time when the hole 20 for mounting is moved to the position of the rotating column by feeding of one pitch. Operation is not wastefully performed because the operation of wire bonding is stopped at a position where there exists no base.
申请公布号 JPS58200552(A) 申请公布日期 1983.11.22
申请号 JP19820083088 申请日期 1982.05.19
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 TAKASUGI NOBUHIRO;SHIGIYOU SEIJI;SUZUMURA YOSHIKAZU
分类号 H01L21/50;H01L21/00;H01L21/60;H01L21/68 主分类号 H01L21/50
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