| 摘要 |
PURPOSE:To prevent the creeping of the resist and the adhesion of a fog-shaped resist to the end surface and back of a wafer, and to obviate the fall-off of the resist by spraying-up a resist solvent from the back during the revolution of the wafer and washing away of the resist creeping from the upper surface of the wafer. CONSTITUTION:A fixed quantity of the resist 25 is dropped from a dispense-tube 24 positioned at the upper section of the wafer 23. The resist 25 dropped is subject to centrifugal force and spread thinly in the radial direction of the wafer 23 because the wafer 23 is turned with the revolution of a spindle 21, and the excessive resist is shaken off from the end surface of the wafer. In this case, the excessive resist intends to round to the surface of the wafer 23, but it is washed away by the resist solvent 27 injected from a nozzle 26 fitted to the lower section of the wafer 23. Accordingly, the excessive resist does not creep to the back of the wafer 23. |
