| 摘要 |
PURPOSE:To remove the outflow of a resin from a section between a sealing frame and a printed circuit substrate, to reduce cost and to improve reliability by using the specific epoxy resin as a potting resin. CONSTITUTION:The epoxy resin 6 used has a singularity of temperature characteristics of which viscosity lowers partially within a specific temperature range Ta to a temperature rise. The temperature of the discharge port of a potting machine is kept within a temperature range Ta in which the viscosity of the resin is minimized, and the temperature of the printed circuit substrate 2 is kept within a temperature range Tb in which the viscosity of the resin increases. When potting the epoxy resin 6, flowability is excellent and the IC 1 is coated superiorly with the resin because the viscosity of the resin is low under the state in which it flow on the IC 1, but the viscosity of a section being in contact with the printed circuit substrate 2 of the epoxy resin 6 increases because the temperature of the printed circuit substrate 2 reaches 60 deg.C or more, and a flow reduces, thus resulting in no outflow of the resin from the lower section of the sealing frame 3. |
