| 摘要 |
PURPOSE:To greatly improve both analysis accuracy and analysis recovery rate without undergoing physical interference of interfering elements by a method wherein solder is dissolved with an acid under heating, and filtrate after filtration is subjected to quantitative analysis based on the standard addition method using an atomic absorption photometer. CONSTITUTION:Solder of 0.5-1.0g as a sample is sampled, and nitric acid (1+1) 30ml is added to dissolve the solder under heating. The dissolved solder is cooled and filtered. The filtrate is separately taken out, measured at 324.7nm using an atomic absorption photometer and then subjected to quantitative analysis based on the standard addition method. As shown in the figure, the filtrate consisted of the dissolved solder is added in a certain equal amount to each of Cu standard solutions which have Cu contents stepwisely increased. The indicated amounts are plotted in order. The Cu density of the sample can be determined form the point where the resultant charactersitic curve intersects the X-axis (representing Cu content). Since all the measured solutions contain the sample solution in equal amount, the sample will not undergo any physical interference such as influence of interfering elements present in the sample, viscosity and surface tension. Thus, it becomes possible to greatly improve both analysis accuracy and analysis recovery rate. |
