| 摘要 |
PURPOSE:To execute centering with predetermined accuracy at the same time as the article is transferred and fed to a stage by using the outer circumference of a heat as the centering guide of the transfer jig and aligning the jig to the outer circumference of the head. CONSTITUTION:The wafer transfer jig consists of a semi-doughnut-shaped wafer receiving pan section 3 with the arcuate guide 2 for holding a wafer 1 at a prescribed position, a positioning section 5 with the head 4, which fast sticks the jig to the outer diameter of the head 4 and centers the central section of the wafer and the central section of the head, and a slender grip 6 supporting the wafer receiving pan section 3 for operating the jig. The wafer is centered in such a manner that the outer circumferential surface of the wafer 1 placed onto the wafer receiving pan section 3 is brought into contact with the arcuate guide 2, the wafer 1 is positioned to the wafer receiving pan section 3, the connecting section 5 is fast stuck to the outer circumferential surface of the head 4, and the wafer 1 is placed to the wafer receiving pan section 3. Accuracy in case of the centering of the wafer 1 is determined by the size of the outer diameter of the head 4, the fit size of the diameter of the positioning section 5 and the fit size of the outer diameter of the wafer and the inner diameter of the arcuate guide 2. |
