| 摘要 |
PURPOSE:To contrive not to deteriorate the solderability of lead external end parts by a method wherein grooves wherein edges are made protuberant over the entire region of width are provided on at least one surface of the both surfaces of the lead external parts at the joint of a dam piece. CONSTITUTION:After a pellet 1 is fixed constantly on a tab 2, the electrode of this pellet 1 and the internal end of each lead 4 corresponded thereto are connected by wires 9, then resin moding is performed, and thus the tab 2, the pellet 1, the wires 9, and the lead internal end parts are covered with a resin package 10. The climb of the resin infiltrated into the groove 13 over the projection 14 at the other edge of the groove 13 hardly generates. The unecessary lead frame parts of the dam piece 5, a frame 6, etc. are cut and removed, the lead (external lead 7) 4 projected out from the resin package 10 is formed, and accordingly a dual in-line type semiconductor device is formed. |
