| 摘要 |
PURPOSE:To obtain the tape carrier being easy to mount by a method wherein a semiconductor element is held by a thin conductor enabled to be sheared by minute force in the condition that leads are cut apart from the tape. CONSTITUTION:After outside terminals 3 are cut apart, a semiconductor chip is held to the tape by copper foil of several 10mum thickness, and the terminals 3 hold to stand in a row. When the chip on the tape carrier is to be connected to a wiring substrate, the terminals 3 are connected by pressing and heating to the substrate using a jig for exclusive use. The holding conductor 4 can be cut apart from the tape at the same time with connection to the substrate using the jig for exclusive use having heating faces 5 for the terminals 3, cutters 6 for foil, for example, and the element can be connected in the condition standing in a row. According to this construction, the chip can be supplied cutting apart the outside terminals previously, and a user can mount easily even without a mold or a press device. |
