| 摘要 |
PURPOSE:To enhance the general-purpose property of a ceramic substrate whereon semiconductor elements are mounted and thus enable the mount of many kinds of semiconductor elements with a kind of ceramic substrate by a method wherein the bxtended part of metallic wirings conducted to the back surface or electrode of a semiconductor element is provided close to a metallic terminal. CONSTITUTION:A metallic layer 10 called an island is provided at the bottom of cavity 2 provided on the ceramic substrate 1, and the semiconductor element 3 is fixed thereon. The island is generally formed by plating Ni and further Au, after screen printing of the ink wherein particles of tungsten W or molybdenum Mo are diffused before calcination of the ceramic substrate and calcinating it. Next, the electrodes 11 of the semiconductor element 3 and bonding pads 4 are connected by metallic fine wires 5 with Au or Al as the main consistuent. The extended part 12 projects out from the island 10, which is connected to the pad 14 on the surface of the ceramic substrate through a through hole 13. On the other hand, the metallic terminal 15 extend from a metallic ring in access to the pad 14. |
