发明名称 LAMINATED FERRITE CHIP INDUCTOR ARRAY
摘要 PROBLEM TO BE SOLVED: To provide a laminated ferrite chip inductor array with improved structure for preventing defects of short circuits caused by migration in an inner conductive material, even if the body has a minute 2010 shape (length 2.0 mm, breadth 1.0 mm, and height 1.0 mm). SOLUTION: In a coil-shaped structural laminate, a plurality of ferrite sheets with a U-shaped inner conductive pattern are so laminated in layers that U-shaped inner conductive patterns on the adjoining sheets face opposite each other, and at the same time, the inner conductive printed patterns are connected electrically via a through-hole drilled in the ferrite sheet. An array includes a plurality of channels formed by annealing the coil-shaped structural laminated bodies and stored in a ferrite ceramic. In this case, each adjoining chip inductor are located with its inner conductive pattern shape at a rotated angle of 180 deg. with respect to each other.
申请公布号 JP2000182835(A) 申请公布日期 2000.06.30
申请号 JP19980356813 申请日期 1998.12.15
申请人 TDK CORP 发明人 UCHIKOBA FUMIO;ANPO TOSHIYUKI
分类号 H01F1/34;H01F17/00;H01F27/00 主分类号 H01F1/34
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