| 摘要 |
PURPOSE:To obtain a high quality resist film by rejecting generation of reflection phenomenon of resist within a cup and preventing generation of a thin film in the space within a cup through introduction of a structure which allows rotation of a cup accommodating a vacuum chuck which rotates a material to be processed. CONSTITUTION:The bottom end of a cup body 30 accommodating semiconductor wafer 31 which is to be processed is coupled to the floor plate 32 having an exhaust tube 34 through a bearing 33 and the body 30 is rotatable around the fixed floor plate 32 by means of a gear 39 provided at the one side surface of said body 30. This rotation is caused by a rotating axis 40a extruded from a motor 40. A vacuum chuck 35 which rotates by means of the motor 36 is engagingly inserted to the center of floor plate 32, a resist nozzle 38 is placed thereon, the upper side of body 30 is bent horizontally in such a way as surrounding external circumference of wafer 31. Thereby, the resist dropped on the wafer 31 is sprashed up to the internal wall surface 30a of the body by a centrifugal force. But since the body itself 30 is also rotating, such resist is not reflected onto the resist film. |
