发明名称 PHOTO-CURING TYPE ELECTROCONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To obtain a photo-curing type electroconductive paste capable of eliminating a limitation at a substrate side by paying attention to the merit of the photo-curing type electroconductive paste that the paste is cured by irradiation with light rays, increasing coating performances, improving flex resistance of obtained electroconductive layer and forming an excellent electroconductive layer using the photo-curing type electroconductive paste. SOLUTION: This photo-curing type electroconductive paste contains at least one of a silica having >=100 m2/g specific surface area, <=50 g/l apparent specific gravity and <=30 nm average primary particle diameter, a saturated polyester resin having <=100 deg.C softening point and 1,000-50,000 molecular weight, a polyvinyl ether resin having <=-30 deg.C glass transition point and a phenoxy resin having >=100 deg.C softening point.
申请公布号 JP2000319583(A) 申请公布日期 2000.11.21
申请号 JP19990125307 申请日期 1999.04.30
申请人 TOPPAN FORMS CO LTD 发明人 ENDO YASUHIRO;KAGAMI YASUO;MARUYAMA TORU
分类号 C09D167/00;C09D5/24;C09D171/00;(IPC1-7):C09D167/00 主分类号 C09D167/00
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