发明名称 AUTOMATIC POLISHING DEVICE AND POLISHING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent excessive polishing and insufficient polishing by holding a body to be polished and a polished reference body on a holding means, detecting a designated physical quantity during polishing using a polishing means, and ending the polishing work of the polishing means according to the detection signal. SOLUTION: In the case of polishing both surfaces of a substrate such as a quartz substrate, a glass substrate or the like, a lower polishing table 3 and an upper polishing table 4 respectively provided with a polishing pad are disposed, and a holder 1 having plural glass substrates held thereon is disposed between both polishing tables 3 and 4. When the respective polishing tables 3, 4 are rotated by rotating motors 6, 7 to perform polishing, the turning torque of the rotating motor 6 is detected by a torque sensor 8, and a torque signal Tx from the torque sensor 8 is sampled at a fixed interval by a sensor signal collecting means 9 to be compared with a reference torque signal To stored in a storage means 11. When the comparison result is Tx>To, the end of polishing is decided by a deciding part 12.
申请公布号 JP2000354963(A) 申请公布日期 2000.12.26
申请号 JP19990166370 申请日期 1999.06.14
申请人 NEC CORP 发明人 FUKUZAWA HIROAKI;OKAWA KATSUHISA
分类号 B23Q17/09;B24B49/10;(IPC1-7):B24B49/10 主分类号 B23Q17/09
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