发明名称 CUTTNG AND MACHINING PROCESS
摘要 PURPOSE:To facilitate disposal of chip by a method wherein a rod-like workpiece are heated in advance along several lines extending axially along an outer circumference thereof, by applying laser beams to form a thermally affected area therein and this area is cut to produce separated chips. CONSTITUTION:Some laser beams 7 are converged in a surface by a laser gun 5 so as to apply a fine thermally affected area 6 corresponding to a finishing margin to a surface of the workpiece 1 and a plurality of thermally affected area 6 are formed. Then, the workpiece 1 is held by a head stock 11 of the lathe and finished by a cutting tool 12 in the lathe. The cut chips are divided into further fine chips by said thermally affected areas 6 to facilitate the disposal of the chips.
申请公布号 JPS58196901(A) 申请公布日期 1983.11.16
申请号 JP19820080652 申请日期 1982.05.13
申请人 MITSUBISHI JUKOGYO KK 发明人 SATOU SHIYOUZOU;BETSUPU SEIJI
分类号 B23B1/00;B23B25/02 主分类号 B23B1/00
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