| 摘要 |
PURPOSE: A chemical dispensing method of a nozzle moving type is provided to uniformly coat the wafer surface with a liquid chemical used for an interfacial insulation layer, by using a dispensing method. CONSTITUTION: A wafer(1) fixed to a wafer support plate(10) is rotated. A nozzle moves from an edge of the wafer to a center part of the wafer, and dispenses a chemical used for the interfacial insulation layer. The nozzle is moved along a straight line. Thereby, by using a dispensing method of a nozzle moving-type, the chemical dispensing method uniformly coats the wafer surface with a liquid chemical used for an interfacial insulation layer.
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