| 摘要 |
PURPOSE:To enable built-in solder immersion by face bonding by inserting the electrode of a high frequency coil into the window of a solder proof bottom plate, covering a shield case with a solder proof case and immersing in solder. CONSTITUTION:As electrode 4 is inserted into the window 6 of a solder proof bottom plate 15 in the side of a projection 3 formed on the base body of a high frequency coil, and covered with a solder proof case 17 to cover the shield case 8. Then, temporary fixing bond 18 is applied to fix temporarily the chip parts and high frequency coil to a conductive foil 12 on the circuit base plate 11. After hardening of the bond, soldering 19 is performed by solder immersion method. After soldering, only the solder proof case 17 is removed by a jig etc. By this way, soldering can be performed using built-in immersion system by face bonding even for a high frequency coil having variable mechanism. |
