发明名称 |
Thermal conduction element for semiconductor devices |
摘要 |
A disk shaped thermal bridge element for use in a semiconductor package to conduct heat from a device to a cold plate, which disk element has a bulged shape with a first set of inwardly extending slots and a second set of outwardly extending slots emanating from the center of the disk.
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申请公布号 |
US4415025(A) |
申请公布日期 |
1983.11.15 |
申请号 |
US19810291218 |
申请日期 |
1981.08.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HORVATH, JOSEPH L. |
分类号 |
H01L23/36;H01L23/367;H01L23/433;(IPC1-7):H01L23/36 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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