| 摘要 |
PURPOSE:To reduce the soft error frequency due to alpha particles improving moisture proof by a method wherein both organic high molecular filler and inorganic filler are utilized as the filler of sealing resin for semiconductor element comprising an organic resin. CONSTITUTION:Both organic high molecular filler and inorganic filler are utilized as the filler of sealing resin for semiconductor element comprising an organic resin. Epoxy resin, unsaturated polyester resin, phenol resin, melamine resin etc. may be utilized as the organic high molecular filler while silica powder, alumina powder, clay powder, talc powder etc. may be utilized as the inorganic filler to prevent soft error due to alpha particles from happening. |
