| 摘要 |
PURPOSE:To reduce the soft error frequency due to alpha particles improving moisture proof by a method wherein an organic high molecular filler is utilized as the filler of sealing resin for semiconductor element comprising organic resin. CONSTITUTION:An organic high molecular filler is utilized as the filler of sealing resin for semiconductor element comprising an organic resin. Epoxy resin, unsaturated polyester resin, phenol resin, melamine resin and the like may be utilized as the organic high molecular filler to prevent soft error due to alpha particles from happening. |
