| 摘要 |
PURPOSE:To improve the cooling efficiency of a cooling device, and to enable the high-density packaging of a semiconductor element by cooling a cooling fin disposed onto the semiconductor element from both inner and outer surfaces. CONSTITUTION:The heat generation P of a semiconductor element 1 is dissipated in the two directions of the side, the P1 direction, of a cooling fin 2 and the upper section, the P2 direction, by primary air 7 and secondary air 8 each having independent route. Heat dissipated in the P2 direction is absorbed by secondary air 8 flowing in a chamber 5, and heat dissipated in the P1 direction is absorbed by primary air 7 flowing on the outside of the cooling fin 2. Accordingly, primary air 7 and secondary air 8 for cooling the semiconductor element 1 are separated completely, and have particularly large endotherm, thus preventing the effect of secondary air 8 having a high temperature-rise ratio on primary air 7. |
