WAFER PACKING METHOD, PREVENTING SURFACE DEGRADING

摘要

PURPOSE: A method for packing wafers without degrading surfaces thereof is provided to effectively prevent the degradation of surfaces of wafers due to the increase of haze or particles on the surfaces when maintaining or transferring the wafers for a long time of about 45 days, thereby smoothing the supply of the wafers. CONSTITUTION: A method for packing wafers without degrading surfaces thereof includes the steps of putting a cassette(100) incorporating wafers into a packing bag by inserting the cassette into a polypropylene bag and next into an aluminium bag(300) after sealing the polypropylene bag loosely, and sealing the packing bag by molding rims of the aluminium bag by mechanical force while tightly contacting the aluminium bag with an outer shape of the cassette, cutting unnecessary rims and sealing the packing bag, wherein the wafers are 300mm.