| 摘要 |
PURPOSE:To provide a thermosetting compsn. which gives cured articles having excellent heat resistance, adhesion and electrical insulating properties, etc., and is suitable for use as varnish, by mixing a specified polyparabanic acid with an epoxy resin having epoxy groups and a hardener. CONSTITUTION:A diisocyanate is reacted with hydrogen cyanide and the resulting polymer is hydrolyzed to obtain a polyparabanic acid composed of a repeating unit of formula I (wherein Z and Z1 are each O or NH; R is a member selected from the group consisting of groups having the formulas II, III, IV, etc.; and R<1> and R<2> are each H or methyl) wherein at least 75% of said repeating unit is composed of a repeating unit of formula V. The polyparabanic acid is mixed with an epoxy resin having at least two epoxy groups per molecule and a hardener (e.g., dicyandiamide) to obtain a desired thermosetting compsn. The compsn. is suitable for use as varnish for use in the filed of electronic components such as printed circuit boards, etc. |
