发明名称 Laser scanning method for annealing, glass flow and related processes
摘要 A method for scanning the top surface of a semiconductor wafer prevents damage to the wafer (11) by ensuring that the laser beam (13) does not cross over the edge (11a) of the wafer during the scanning process nor approach within one (1) to two (2) millimeters to the edge of the wafer.
申请公布号 US4415794(A) 申请公布日期 1983.11.15
申请号 US19810244395 申请日期 1981.03.16
申请人 FAIRCHILD CAMERA AND INSTRUMENT CORPORATION 发明人 DELFINO, MICHELANGELO;REIFSTECK, TIMOTHY
分类号 H01L21/20;H01L21/268;H01L21/31;H01L21/3105;(IPC1-7):B23K27/00 主分类号 H01L21/20
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