| 摘要 |
PURPOSE:To abbreviate equipments and the manhours in the manufacture, and to reduce the cost of the semiconductor by a method wherein the external shapes and sizes of insulating bases to be fixed with the groups of probes are made the same, and the insulating bases are fixed directly to printed substrates without providing spot facings. CONSTITUTION:The external shapes and sizes of the total insulating bases 4, 4' are made the same, and sizes of the inside diameters thereof are designed at several mm. interval. Openings 2a having the common diameter are provided in the printed substrates 2 corresponding to the external shape and size of the insulating bases 4, 4', the groups of the probes 5 are fixed to the insulating bases 4, 4' selected corresponding to sizes of various semiconductor devices as to coincide with the electrode parts of the semiconductor devices, and the insulating bases 4, 4' are fixed directly to the printed substrates 2 by an adhesive without providing the spot facings. Moreover, the groups of the probes 5 and the wirings of the printed substrates 2 are soldered to be wired. By making the external shapes and sizes of the total insulating bases 4, 4' the same, the openings 2a of the printed substrates can be made to have the common diameter, and even when sizes of the inside diameters R1, R2 of the insulating bases 4, 4' are different to each other, to make the diameters of the openings 2a to be different is made unnecessary, and commonness of the printed substrates can be attained. Moreover, because the insulating bases 4, 4' are fixed to the printed substrates 2 without providing the spot facings, the spot facing process can be omitted, and the equipments and the manhours in the manufacture can be saved. |
