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发明名称
AUTOMATIC SOLDERLESS BONDING DEVICE
摘要
申请公布号
JPS58194275(A)
申请公布日期
1983.11.12
申请号
JP19820002749
申请日期
1982.01.13
申请人
HITACHI SEISAKUSHO KK
发明人
NANRI NOBUYUKI;TAZAWA SEIJI
分类号
H01R43/05;H01R43/04
主分类号
H01R43/05
代理机构
代理人
主权项
地址
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