发明名称 METHOD AND APPARATUS FOR EXPOSURE, AND DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To position or scan an object (wafer, etc.), under exposure, at high speed and with high accuracy. SOLUTION: An image of a mask pattern in transferred on a wafer W1 through a projection optical system PL. The wafer W1 is held on a sample table 69 via a wafer holder 43A, the sample table 69 is mounted on an intermediate plate 65 via three balls 67A, 67B, etc., the plate 65 is supported on a movable stage 61 via three Z-axis actuators 66A, 66B, etc., in three-degrees of freedom attitude controllable condition, and the movable stage 61 moves two- dimensionally on a guide surface 38a. Between the intermediate plate 65 and the sample table 69, an X- and Y-axis actuators 72XA, 72YA are installed to drive the sample table 69 in a direction parallel to the guide surface 38a.
申请公布号 JP2002164269(A) 申请公布日期 2002.06.07
申请号 JP20000359387 申请日期 2000.11.27
申请人 NIKON CORP 发明人 NISHI TAKECHIKA;ONO KAZUYA
分类号 G12B5/00;G03F7/20;G03F7/22;H01L21/027;(IPC1-7):H01L21/027 主分类号 G12B5/00
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