| 摘要 |
PURPOSE:To improve the reliability of the joining of a conductor and a junction pad by removing one part of a multilayer insulating film under the junction pad. CONSTITUTION:First layer Al wiring 7 is formed onto a Si substrate 1 through PSG6 according to a conventional method, PSG8 and a polyimide film 9 are superposed, the film 9 is bored, and Al wiring 12 is attached. However, the polyimide film 9 is removed in the lower region of the junction pad 12. Accordingly, when a metallic wire 14 is joined, the device can be joined excellently because deformation and cracks are not generated in an insulating film. |
