| 摘要 |
PURPOSE:To reduce the cost of products, and to improve reliability by using a lead frame blank coated with Al. CONSTITUTION:A board material coated with Al 2 is prepared as the blank 1 for a lead frame. The lead frame is formed through processing, such as a punching press or photoetching or the like to the blank 1. A semiconductor pellet 9 is bonded on a tab, and wires 10 are thermocompression-bonded among each electrode of the upper surface of the pellet 9 and leads. The pellet and one parts of the leads are sealed with a surrounding resin molding 11. The Al of the surfaces of lead sections 7 exposed outside a resin is removed through etching while using the resin molding as a mask. The surfaces of outer leads from which Al is removed are coated with solder 12. Accordingly, the cost of materials can be economized and processes simplified. Wetproofing is improved because Al has excellent adhesive property with the resin. |
