| 摘要 |
PURPOSE:To connect the electrode of a semiconductor pellet and a conductive layer to an external lead efficiently with high accuracy by using a pattern wiring board without using a wire. CONSTITUTION:The wiring board 7 to which a wiring pattern 8 capable of connecting the electrodes 4 of the semiconductor pellet 3 and the conductive layers 5 is formed is manufactured to the back. The board 7 is made of ceramics, etc., is formed in size in which it is fitted to the concave section 2 of a base 1, and combines a cap for airtight sealing. Wiring to which Au is evaporated may be mounted to a transparent board. When the board 7 is pushed into the concave section 2 of the base 1 after the pellet is fitted and compression-bonded, the electrodes 4 and the conductive layers 5 are all connected at the same time by the wiring pattern 8, and can be joined efficiently with high accuracy. |
