发明名称 |
One-package, heat-curable compositions suitable for use as sealants, solid coatings and moldings. |
摘要 |
<p>Formulations comprising two or more reactants in which each reactant is blocked to render it unreactive at temperatures below 100°C (38°F) are disclosed. These formulations have utility in the fields of one-package insulating glass sealant compositions, high solids coatings, and reaction injection molding.</p> |
申请公布号 |
EP0093491(A1) |
申请公布日期 |
1983.11.09 |
申请号 |
EP19830301327 |
申请日期 |
1983.03.10 |
申请人 |
THIOKOL CORPORATION |
发明人 |
BERTOZZI, EUGENE R.;MACMILLAN, JOHN H.;STREETER, BRUCE E. |
分类号 |
C09K3/10;C08G18/00;C08G18/10;C08G18/32;C08G18/64;C08G18/65;C08G18/69;C08G18/80;E06B9/24;F16J15/14;(IPC1-7):08G18/10;08K5/00;08G18/32;08G18/64;08G18/69 |
主分类号 |
C09K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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