发明名称 One-package, heat-curable compositions suitable for use as sealants, solid coatings and moldings.
摘要 <p>Formulations comprising two or more reactants in which each reactant is blocked to render it unreactive at temperatures below 100°C (38°F) are disclosed. These formulations have utility in the fields of one-package insulating glass sealant compositions, high solids coatings, and reaction injection molding.</p>
申请公布号 EP0093491(A1) 申请公布日期 1983.11.09
申请号 EP19830301327 申请日期 1983.03.10
申请人 THIOKOL CORPORATION 发明人 BERTOZZI, EUGENE R.;MACMILLAN, JOHN H.;STREETER, BRUCE E.
分类号 C09K3/10;C08G18/00;C08G18/10;C08G18/32;C08G18/64;C08G18/65;C08G18/69;C08G18/80;E06B9/24;F16J15/14;(IPC1-7):08G18/10;08K5/00;08G18/32;08G18/64;08G18/69 主分类号 C09K3/10
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