发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve the reliability of connection, to increase the number of internal leads and to cope with a change into multiple pins by setting up a relay lead between a pellet and the lead and connecting the relay lead to each of them. CONSTITUTION:The size of a tab 2 is enlarged, a region in which the internal leads 3 are arranged is spread, and number of which the leads 3 can be disposed is increased. The relay leads 7 are disposed and formed around a square Si substrate 8 and thin-film leads 9 radially only by number corresponding to the internal leads 3 on the tab 2, and both ends of the leads 9 are spread slightly and the joining of wires is facilitated. The leads 7 are fixed onto the tab 2 by an AuSi eutectic, the pellet 10 is fastened at a central section, the electrode pad 11 of the pellet and the inner terminals of the leads 9 and the outer terminals of the leads 9 and the leads 3 are connected 13, and the whole is sealed 14 with a resin according to a predetermined method. According to the constitution, the reliability of connection is improved even when the number of the electrode pad 11 and the leads increase attendant with the increase of a degree of integration of the pellet 10, and the device of high reliability corresponding to the change into multiple pins is obtained.
申请公布号 JPS58192334(A) 申请公布日期 1983.11.09
申请号 JP19820075292 申请日期 1982.05.07
申请人 HITACHI SEISAKUSHO KK 发明人 USAMI TAMOTSU;HOSOSAKA HIROSHI;OOTSUKA KANJI
分类号 H01L23/50;H01L21/60 主分类号 H01L23/50
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