发明名称 |
Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger |
摘要 |
A polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups useful for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of the composition is applied to a substrate such as a coated silicon wafer which is the base for an electrical device, dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure with sharp definition and has good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: radiation sensitive polymerizable polyfunctional acrylate compound and photopolymerization initiators containing hydrogen donor initiator and aromatic biimidazole, and an oxygen scavenger.
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申请公布号 |
US4414312(A) |
申请公布日期 |
1983.11.08 |
申请号 |
US19810334164 |
申请日期 |
1981.12.24 |
申请人 |
E. I. DU PONT DE NEMOURS & CO. |
发明人 |
GOFF, DAVID L.;YUAN, EDWARD L.;PROSKOW, STEPHEN |
分类号 |
C08F290/14;G03F7/037;H01L21/312;(IPC1-7):G03C1/68 |
主分类号 |
C08F290/14 |
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地址 |
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