| 摘要 |
PURPOSE:To prevent invasion of water to the bed part of the semiconductor device by a method wherein the bed part of a lead frame at the resin sealed type IC is accommodated completely inside of resin, and is isolated completely from the outside. CONSTITUTION:The tip parts of supporting pins 13, 14 integrated in one body to the bed 12 holding the IC pellet 11 is covered completely by epoxy resin 15, and are fixed to adjoining leads 16, 16... by polyimide tapes 18. Because the supporting pins 13, 14 of the bed 12 are not coming in contact with the air, invasion of water coming along the supporting pins 13, 14 can be prevented, deterioration of the characteristic of the IC pellet 11 and corrosion of patterned Al electrodes, Al wirings are not generated, and reliability is enhanced remarkably. |
