| 摘要 |
PURPOSE:To make impact force generated when the device lands from the projected part by reverse drop to be absorbed by a slit part, and to enhance the drop impact proof quantity of the semiconductor device by a method wherein the slit is provided at the outside exposed part of a radiator plate whose a part is exposed outside from a vessel enclosing a chip, and the projection is provided outside. CONSTITUTION:A part of the inside radiator plate 102 mounting the chip 101 is exposed from molded resin 104. Holes 203 for tightening according to screws are connected mutually with the slit 307 having width narrower than the diameter of the screws, and the upper side face part 206 of the exposed part 102 of the inside radiator plate is projected outside. Accordingly when the device drops reversely, the device lands from the projected upper side face part 206, while impact is absorbed concentrically by the slit 307 to reduce direct impact to the chip 101, and the drop impact proof quantity can be enhanced large. |
