发明名称 |
Defoaming electronic hardware |
摘要 |
Printed wiring board assemblies (12) and the like encapsulated in foam (28) may be removed by use of a pair of sandwich structures (30) placed about the assembly. Each sandwich structure includes a pair of perforated sheets (36) with a sinuously extending filament (40) sandwiched between the sheets. Defoaming is effected by pulling the filament from the foam through the intermediary of a tool grasping ends (52) of the filament.
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申请公布号 |
US4414606(A) |
申请公布日期 |
1983.11.08 |
申请号 |
US19810274011 |
申请日期 |
1981.06.15 |
申请人 |
HUGHES AIRCRAFT COMPANY |
发明人 |
ANDERSON, EDWARD A.;BENNETT, BENJAMIN;GRAY, BILLY D. |
分类号 |
H05K3/28;(IPC1-7):H05K1/16;H05K3/00 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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