发明名称 CUTTING ARRANGEMENT SYSTEM FOR OPTICAL FILM
摘要 PROBLEM TO BE SOLVED: To provide a cutting arrangement system for an optical film for efficiently processing work up to cutting and collecting without producing defectives in work of cutting the optical film in matrix shape and stacking while removing the defectives on the way. SOLUTION: The cutting arrangement system for the optical film is fully automated by directly docking a main device for obtaining chip films of matrix shape by longitudinally and laterally cutting the optical film fixed on an underlay, and a transfer device capable of sucking the chip films as they are without breaking the matrix arrangement to transfer them on a conveyor, eliminating a manual operation part. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005231009(A) 申请公布日期 2005.09.02
申请号 JP20040046328 申请日期 2004.02.23
申请人 NIPPON SYSTEM GROUP:KK 发明人 FUMINO YUTAKA
分类号 B26D7/32;B26D1/08;B26D7/02;B26D7/27;(IPC1-7):B26D7/32 主分类号 B26D7/32
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