发明名称 METHOD AND DEVICE OF CRYSTALLIZING THIN FILM MATERIAL
摘要 <p>When crystal particle size cannot be uniformed, it is impossible to reduce variations in TFT characteristics over the entire panel. A method of crystallizing a thin film material comprising the step of splitting a pulse-form laser into a plurality of split lasers and delaying them and irradiating a material (12, 112) with them when the thin-film-form silicon material (12, 112) is irradiated with a pulse-form laser several times to form crystals, wherein the pulse waveform (2) of one pulse-form laser formed by a plurality of superimposed split lasers has a maximum peak (23) having the maximum intensity I, at least one maximum peak (22) having an intensity exceeding I/2, and at least one minimum point (21) positioned between adjacent maximum peaks (22, 23) and having an intensity lower than I/2.</p>
申请公布号 WO2006103836(A1) 申请公布日期 2006.10.05
申请号 WO2006JP302459 申请日期 2006.02.13
申请人 THE JAPAN STEEL WORKS, LTD.;KATO, OSAMU;INAMI, TOSHIO;SHIDA, JUNICHI;CHUNG, SUK-HWAN;SAWAI, MIKI;KOYANO, AKINORI;KOBAYASHI, NAOYUKI 发明人 KATO, OSAMU;INAMI, TOSHIO;SHIDA, JUNICHI;CHUNG, SUK-HWAN;SAWAI, MIKI;KOYANO, AKINORI;KOBAYASHI, NAOYUKI
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786 主分类号 H01L21/20
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