发明名称 Pump for chemical (electroless) copper and nickel baths
摘要 The present pump is applied in electroplating principally for evacuating vessels which contain copper and nickel baths, irrespective of their dimensions. Because of undesired metal deposits from the liquid, the shaft driven by the motor is introduced into the pump housing with the interposition of an isolating gap which must, however, continually be filled with liquid in order to rule out access of air to the interior of the pump housing. The isolating gap is extended so far with respect to the vessel to be evacuated that its overflow is situated above the highest possible liquid level in the vessel. In the case of spacious vessels, it still operates perfectly as a submersible pump even if the liquid level drops away over the pump housing to the bottom. In the case of vessel dimensions that are too small, it is connected outside at the bottom drain of the vessel, and after being appropriately mounted it evacuates the vessel almost completely during the start-up.
申请公布号 DE3215247(A1) 申请公布日期 1983.11.03
申请号 DE19823215247 申请日期 1982.04.23
申请人 BOHNCKE,JOHANNES H. 发明人 VERZICHT DES ERFINDERS AUF NENNUNG
分类号 F04D7/06;(IPC1-7):F04D7/06 主分类号 F04D7/06
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