A device for desoldering electronic components from circuit boards has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.
申请公布号
US4412641(A)
申请公布日期
1983.11.01
申请号
US19810302077
申请日期
1981.09.14
申请人
ERSA ERNST SACHS GMBH & CO. KG
发明人
FUCHS, GOTTFRIED;GARRECHT, EWALD;RIECK, LOTHAR;RUEPPEL, WOLFGANG;SCHWARZ, RUDOLF;SIEGLE, ERICH