| 摘要 |
PURPOSE:To prevent the CI value of a crystal oscillator and the frequency-temperature characteristics from being deteriorated, by avoiding solder from flowing to exciting electrodes, in bonding a supporting member and a crystal chip. CONSTITUTION:A solder flow preventing section 7 is formed by forming a metal such as Cr having bad solderability at a part of a bonding section 4 provided to a crystal chip 1. In soldering a metallic supporting member 5 to the section 4, a solder 6 is blocked at the section 7 and not flowed to an exciting electrode 2 provided to a main plane of the crystal chip 1 and its vicinity, allowing to obtain the crystal oscillator having a good performance without dispersion. |
