发明名称 BONDED MOLDING OF OLEFIN POLYMER MIXTURE
摘要 <p>PURPOSE:A bonded product of a high bonding strength, prepared by adding a specified unsaturated organic compound and an organic peroxide to an olefin polymer, molding the mixture, coating the surface of the molding with an isocyanato group-containing adhesive and bonding the molding to an adhered. CONSTITUTION:To 100pts.wt. olefin are added 0.1-50pts.wt. organic compound having at least one unsaturated bond and a hydroxyl group in the molecule (e.g., 2-hydroxyethyl acrylate, 2-hydroxypropyl methacrylate), and 0.01-20pts.wt. organic peroxide (e.g., benzoyl peroxide, dicumyl peroxide), and the resulting mixture is molded. The surface of the molding is coated with an isocyanato group-containing adhesive (e.g., solvent type urethane adhesive, water-based vinylurethane adhesive), and the molding is bonded to an adherend.</p>
申请公布号 JPS58185633(A) 申请公布日期 1983.10.29
申请号 JP19820068609 申请日期 1982.04.26
申请人 SHOWA DENKO KK 发明人 NAGAI YOUZOU;SEKIGUCHI SABUROU;TAKAISHI MINORU
分类号 C08L23/00;B32B27/32;C08J5/12;C08K5/04;C08K5/05;C08K5/10;C08K5/14;C08L7/00;C08L21/00;C08L23/02;C08L51/00;C08L51/02;C08L51/06;C08L53/00;C08L77/00;C08L101/00;C09J5/00 主分类号 C08L23/00
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