发明名称 METHOD FOR FIXING LEAD WIRE
摘要 PURPOSE:To obtain the connection of a lead wire and a conductive layer satisfying both properties, that is, heat resistance and bonding strength, by a method wherein the lead wire is contacted with and fixed to the conductive layer by laminating a fixing plate to the surface of a ceramic material and subsequently welded to said conductive layer by baking. CONSTITUTION:An oxygen pump element 2 having electrodes 6, 7 and leader wires 8, 9 provided to the front and the back surfaces thereof by printing, an oxygen concn. cell element 3 having electrodes and lead wires similarily provided thereto by printing and a spacer 4 are laminated in such a state that the spacer 4 is interposed between both elements and an org. solvent is applied to each contact surface. In the next step, a ceramic fixing plate 21 having lead wires 14, 15 such as platinum wires inlaid with the linear grooves 27, 28 thereof is stacked on the terminal end part of the oxygen pump element 2 in the side of lead wires 8, 9 thereof by using an org. solvent while a raw fixing plate 22 having lead wires 16, 17 similarily inlaid with the linear grooves 29, 30 thereof is stacked to the oxygen concn. cell element 3 and the whole is baked to prepare an oxygen sensor 20. The terminal end parts of the leader wires, the conductive layer of an lead out part and the fixing plates melted during baking wet the surfaces of the lead wires in a similar state while the lead wires are welded in such a state that the contact areas thereof are widened and the lead wires are fixed along with the conductive layer in a strongly bonded state after baking.
申请公布号 JPS58184538(A) 申请公布日期 1983.10.28
申请号 JP19820067840 申请日期 1982.04.22
申请人 NIPPON TOKUSHU TOGYO KK 发明人 YAMADA TETSUMASA
分类号 G01N27/04;G01N27/00;G01N27/12;G01N27/407;G01N27/409 主分类号 G01N27/04
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